賢昇科技 KENSHO:首頁

SEMICONDUCTOR
LASER Debonding and Cleaning Equipment
LASER Debonding Equipment
Macro Inspection Equipment
X-ray bump/void Inspection Equipment
Reliable 3D and 2D measurements for multi process
Special customized machines Made in Germany
X-Ray Diffractometers
TSV RDL Copper Pillar Plating
Hybrid Microscope
3D IC TSV Back Grinding Process Inspection
Wafer Bump Inspection and Measurement System
Flip Chip Bonder
High Accuracy Die Mounter
High Accuracy Dispenser
3D CT X-RAY Inspection (Offline)
X-Ray Inspection (Offline)
Wafer Vacuum Printer
Dispenser
Chemical Control Valve