賢昇科技 KENSHO:首頁

SEMICONDUCTOR
Reliable 3D and 2D measurements for multi process
Special customized machines Made in Germany
X-Ray Diffractometers
TSV RDL Copper Pillar Plating
Hybrid Microscope
3D IC TSV Back Grinding Process Inspection
Wafer Bump Inspection and Measurement System
Wafer Micro Bump X-Ray Inspection System
Flip Chip Bonder
High Accuracy Die Mounter
High Accuracy Dispenser
3D CT X-RAY Inspection (Offline)
X-Ray Inspection (Offline)
Wafer Vacuum Printer
Dispenser
Chemical Control Valve