Vacuum Reflow
Vacuum Soldering
1.Voids will be reduced up to 99﹐ solder joints quality optimized
2.Double sided PCBs
3.Suitable for PCBs﹐ DCB﹐ stamping grid and carrier
4.Setting Parameter: evacuation time﹔ vacuum hold time﹔ ventilation time﹔ vacuum pressure
5.Only one sealing surface of the vacuum chamber
＂Vacuum Plus＂ is a system for improving quality of solder joints. Voids are reduced in a vacuum chamber which significantly improves the quality of the soldered product.
2.Double sided PCBs
3.Suitable for PCBs﹐ DCB﹐ stamping grid and carrier
4.Setting Parameter: evacuation time﹔ vacuum hold time﹔ ventilation time﹔ vacuum pressure
5.Only one sealing surface of the vacuum chamber
＂Vacuum Plus＂ is a system for improving quality of solder joints. Voids are reduced in a vacuum chamber which significantly improves the quality of the soldered product.
