LASER Debonding and Cleaning Equipment 雷射解離清洗設備

Wet cleaning equipment used after peeling off a temporary bonding layer with a LASER beam.
It removes soot generated by the LASER beam﹐ and peels off a temporary resin/bonding layer in a wet-cleaning process. It can handle various solvents according to the resin to be removed.
Our unique﹐ optimum cleaning mechanism for removing the temporary bonding layer shortens the time required to remove the layer compared to ordinary panel cleaning.
Also﹐ a unique filtering system is used﹐ which enables the solvent to be reused by circulating it﹐ thereby achieving cleaning at low cost.
用雷射解離臨時接合層後使用的濕式清潔設備。
它可去除了雷射產生的煙塵，並在濕式清潔過程中解離了臨時的樹脂/接合層。 它可以根據要去除的樹脂處理各種溶劑。
與常規的面板清潔相比，我們獨特的地方是最佳的清潔機制可去除臨時接合層，從而縮短了去除該接合層所需的時間。
且使用了獨特的過濾系統，該過濾系統使溶劑能夠通過循環而重新使用，從而以低成本實現清潔。

用途：
・ A temporary bonding process for semiconductor packaging forming
・ A temporary bonding process for forming a semiconductor re-distribution layer (RDL)
・ A temporary bonding process for forming an ultra-thin semiconductor
・ Other processes using temporary bonding
・半導體封裝成型臨時接合製程
・半導體再分配層（RDL層）的成型臨時接合製程
・超薄半導體成型臨時接合製程
・其他涉及臨時接合的製程