X-ray bump/void Inspection Equipment Six-2000/3000 X射線凸點/氣泡檢查設備

Equipment to inspect/judge bumps on the wafer automatically.
By transmitting X-rays through voids (air bubbles) inside the wafer﹐ the void diameter (area) is calculated from a transmitted image to automatically judge whether to accept voids exceeding standards.
It uses a microfocus X-ray tube as an X-ray source﹐ and a cutting-edge X-ray digital camera for the X-ray image receiving section﹐ to extract high-resolution images and enable high-precision void inspection.
自動檢查/判斷晶圓凸點的設備。
通過使X射線穿過晶片內部的空隙（氣泡），可以根據所透射的圖像計算空隙直徑（面積），從而自動判斷是否接受超過標準的空隙(氣泡)。
它使用微焦點X射線管作為X射線源，並使用尖端的X射線數位照相機作為X射線圖像接收部分，以提取高分辨率圖像並實現高精度的空隙(氣泡)檢查。

用途：
　・ Inspection of bumps on silicon wafers
　・ Inspection of soldered areas such as BGA on mounted substrates
　・ Inspection of soldered areas flip-chip-mounted on LED
　・ Inspection of voids on two-layer soldered areas of power devices (IGBT)
  ・檢查矽晶片上的凸起
  ・檢查封裝基板上的BGA等焊接區域
  ・檢查LED的FlipChip封裝上的焊接區域
  ・檢查功率器件（IGBT）兩層焊接區域的空隙(氣泡)