電子裝配

Epoxyset has built a reputation of providing superior excellence in products used for electronics and PCB assembly. Some common applications include underfills﹐ glob top encapsulants﹐ die attach adhesives﹐ and dam-and-fill encapsulation products. Below are products used by manufacturers for these applications.


環氧樹脂在為電子產品和PCB組裝提供的產品中提供卓越的卓越性能而建立了聲譽。一些常見的應用包括底部填充劑，球形頂部密封劑，芯片粘接劑和填滿填充劑產品。以下是製造商用於這些應用的產品。