低膨脹粘合劑

EPOXIBOND low expansion epoxies are engineered to have a low coefficient of thermal expansion (CTE) and low shrinkage. These products are ideal when bonding substrates with different CTE values.


EPOXIBOND低膨脹環氧樹脂經過精心設計，具有低熱膨脹係數（CTE）和低收縮率。這些產品是粘合具有不同CTE值的基材的理想選擇。