聚氨酯灌封化合物

Urethane potting and encapsulating compounds offer advantages when needing to cure at lower temperatures and/or quickly compared to epoxy systems. Urethanes offer better flexibility and crack resistance as well as better adhesion to certain substrates such as many plastics and composites. Many urethane products Epoxyset offers use renewable raw materials making it less harmful to the end user. It is ideal for electronic applications﹐ surface mount technology﹐ and when thermal cycling resistance is a requirement. Epoxyset urethane potting materials have low CTE rates ensuring flexibility at even extremely low temperatures.


與環氧體系相比，當需要在較低溫度下和/或快速固化時，聚氨酯灌封和封裝化合物具有優勢。聚氨酯具有更好的柔韌性和抗裂性，以及對某些基材（例如許多塑料和復合材料）的更好粘合性。許多聚氨酯產品Epoxyset提供使用可再生原料，因此對最終用戶的危害較小。它是電子應用，表面貼裝技術以及需要熱循環電阻的理想選擇。環氧尿烷灌封材料的CTE率低，即使在極低的溫度下也能確保柔韌性。