Wafer Packer 多功能超薄晶圓Packing/Unpacking系統

■ mPT 150/200:
╴Wafer sizes: 150 mm (6”) and 200 mm (8”)
╴Handling of standard﹐ thin﹐ warped﹐ eWLB﹐ wafer with support ring and
╴MEMS wafers
╴Highest level of reliability and availability
╴Optimized footprint
╴5 stations for shipping boxes and packing material
╴Automatic End Effector changing station
╴Two cassette stations
╴Mapping sensor
╴Pre-aligner for 6＂ and 8＂
╴SECS/GEM interface
╴CE certificated
╴SEMI standard compliant

╴晶圓尺寸：150mm（6吋）和200mm（8吋）
╴處理標準、薄、翹曲的eWLB、帶支撐環的晶片和
╴MEMS晶片
╴最高可靠性和可用性
╴優化的佔地面積
╴5個運輸盒和材料包裝站
-自動end effector更換站
-兩個cassette站
╴檢測晶圓用感測器
╴用於6“和8”的預對準器
╴SECS/GEM界面
╴CE認證
╴符合SEMI標準

■ mPT 200/300f:
╴Wafer size: 200mm (8＂) and 300 mm (12”) on frame
╴Handling of wafers on frame
╴Highest level of reliability and availability
╴Two 6 axle robots for optimized footprint
╴Up to 8 stations for shipping boxes and packing material
╴Automatic End Effector changing station
╴Two stations for frame cassettes
╴SECS/GEM interface
╴CE certificated
╴SEMI standard compliant

╴晶圓尺寸：帶框 200mm（8“）和300 mm（12”）
╴處理帶框晶圓
╴最高可靠性和可用性
╴兩個6軸機器人以優化佔地面積
╴最高8個運輸盒和材料包裝站
╴自動end effector更換站
╴兩個用於frame cassettes的工作站
╴SECS/GEM界面
╴CE認證
╴符合SEMI標準

■ mPT 200/300:
╴Wafer size: 200mm (8＂) and 300 mm (12”)
╴Handling of standard﹐ thin﹐ warped﹐ eWLB﹐ wafer with support ring and ╴MEMS wafers
╴Highest level of reliability and availability
╴Two 6 axle robots for optimized footprint
╴Up to 8 stations for shipping boxes and packing material
╴Automatic End Effector changing station
╴Two load-ports
╴Mapping sensor
╴Pre-aligner for 8＂ and 12＂
╴SECS/GEM interface
╴CE certificated
╴SEMI standard compliant

╴晶圓尺寸：帶框 200mm（8“）和300 mm（12”）
╴處理標準、薄、翹曲的eWLB、帶支撐環的晶片和
╴MEMS晶片
╴最高可靠性和可用性
╴兩個6軸機器人以優化佔地面積
╴最高8個運輸盒和材料包裝站
╴自動end effector更換站
╴2個裝載口
╴檢測晶圓用感測器
╴用於6“和8”的預對準器
╴SECS/GEM界面
╴CE認證
╴符合SEMI標準

■ mPT 200/300 neo:
╴Wafer size: 200mm (8＂) and 300 mm (12”)
╴Handling of standard﹐ thin﹐ warped﹐ eWLB﹐ wafer with support ring and ╴MEMS wafers
╴Optimized foodprint
╴High throughput
╴Highest level of reliability and availability
╴Dual arm 3 axis robot
╴Station for shipping boxes
╴Two stations for packing material
╴One station for recycling material
╴GUI/Operator interface with touchscreen
╴Two load-ports
╴Pre-aligner for 8＂ and 12＂
╴CE certificated
╴SEMI standard compliant

╴晶圓尺寸：帶框 200mm（8“）和300 mm（12”）
╴處理標準、薄、翹曲的eWLB、帶支撐環的晶片和
╴MEMS晶片
╴最高可靠性和可用性
╴高產量
╴最高可靠性和可用性
╴雙臂三軸機器人
╴2個運輸盒工作站
╴2個材料包裝站
╴1個材料回收站
╴GUI/操作人員觸控界面
╴2個裝載口
╴檢測晶圓用感測器
╴用於8”和12”的預對準器
╴CE認證
╴符合SEMI標準

■ Configuration Options:
╴Third station for packing material
╴Sorting function w. FOSBs
╴OCR / QR / DMC reader for wafer ID
╴Bar Code Reader for shipping box ID
╴RFID antennas for cassette / FOUP ID
╴Various End Effectors with automatic End Effector change station
╴SECS/GEM interface
╴FFU (filter fan unit) for higher cleanroom class
╴Ionizer with temperature and humidity monitoring
╴Keyboard﹐ manual Lot ID Reader
╴Additional load / unload position for external metrology

配置選項
╴3個材料包裝站
╴FOSBs分類功能
╴OCR/QR/DMC識別晶圓ID
╴Bar Code識別裝運盒ID
╴用於cassette/FOUP ID的RFID antennas
╴各種具更換站的End Effectors
╴SECS/GEM界面
╴FFU（過濾風扇單元），用於更高級別的潔淨室
╴具有溫度和濕度監控功能的Ionizer
╴鍵盤、手動Lot ID讀取器
╴用於外部量測的附加裝卸位置