Wafer Sorter 多功能超薄晶圓分類系統

■ Application:
Sorting﹐ Splitting and Merging.

■ mWS 150/200:
╴Wafer sizes: 150 mm (6”) and 200 mm (8”)
╴Handling of standard﹐ thin﹐ warped﹐ eWLB﹐ wafers with support ring and ╴MEMS wafers
╴Highest level of reliability and availability
╴Optimized footprint
╴Up to six casette stations
╴Automatic End Effector changing station
╴Two cassette stations
╴Mapping sensor
╴Pre-aligner for 6＂ and 8＂
╴SECS/GEM interface
╴CE certificated
╴SEMI standards compliant

╴晶圓尺寸：150mm（6吋）和200mm（8吋）
╴處理標準、薄、翹曲、eWLB、帶有支撐環晶圓以及
╴MEMS晶圓
╴最高可靠性和可用性
╴優化的佔地面積
╴多達六個cassette站
╴自動end effector更換站
-兩個cassette站
╴檢測晶圓用感測器
╴用於6“和8”的預對準器
╴SECS/GEM界面
╴CE認證
╴符合SEMI標準

■ mWS 200/300:
╴Wafer sizes: 200 mm (8”) and 300 mm (12”)
╴Handling of standard﹐ thin﹐ warped﹐ eWLB﹐ wafers with support ring and ╴MEMS wafers
╴Highest level of reliability and availability
╴One dual arm robot on linear track
╴Up to four load ports
╴Wafer flipping function
╴Automatic End Effector changing station
╴Mapping sensor
╴Pre-aligner for 8＂ and 12＂
╴SECS/GEM interface
╴CE certificated
╴SEMI standards compliant

╴晶圓尺寸：150mm（6吋）和200mm（8吋）
╴處理標準、薄、翹曲、eWLB、帶有支撐環晶圓以及
╴MEMS晶圓
╴最高可靠性和可用性
╴一個在線性軌道上的雙臂機器人
╴最多四個裝載端口
╴晶圓翻轉功能
╴自動end effector更換站
╴檢測晶圓用感測器
╴用於8“和12”的預對準器
╴SECS/ GEM界面
╴CE認證
╴符合SEMI標準