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Wafer Handling Systems
Ring Remover
The Ring Remover mRR 200 and mRR 300 enables fully automated handling of film frames and removing pre-cut rings from the laminated 200 mm (8") and 300 mm (12").
實現film frame的全自動處理,並能從200mm(8吋)和300mm(12吋)層壓晶圓移除預切割的ring。

■ mRR 200:
╴Optimized footprint
╴Throughput up to 80 wafers on film frames per hour
╴Cleanroom class ISO class 6
╴CE certificated
╴SEMI Standard compliant

╴優化的佔地面積
╴每小時可在film frame上產出高達80個晶圓
╴潔淨室ISO等級6
╴CE認證
╴符合SEMI標準

■ mRR 300:
╴Optimized footprint
╴Throughput up to 60 wafers on film frames per hour
╴Cassette placement by OHT class 6
╴CE certificated
╴SEMI Standard compliant

╴優化的佔地面積
╴每小時可在film frame上產出高達60個晶圓
╴OHT等級6的cassette放置
╴CE認證
╴符合SEMI標準