Home > SEMICONDUCTOR > Micron Flip-Chip DIE BONDERS > MRSI-H FAMILY 1.5-MICRON FLIP-CHIP DIE BONDERS -
MRSI-H系列: 高速，靈活的1.5微米覆晶黏晶機，適應大批量生產
Micron Flip-Chip DIE BONDERS
MRSI-H FAMILY 1.5-MICRON FLIP-CHIP DIE BONDERS -
MRSI-H系列: 高速，靈活的1.5微米覆晶黏晶機，適應大批量生產
Benefits of MRSI-H Family
The MRSI-H family provides proven superior flexibility for true multi-die﹐ multi-process﹐ multi-product high volume high mix production. These high-speed products deliver the industry-leading speed without sacrificing flexibility﹐ precision or reliability. The MRSI-H family targets the manufacturing challenges driven by 5G wireless network rollout and the high growth high-power semiconductor laser diode (HPLD) market. MRSI reclassified H series by application.
MRSI-H-LD
• This standard system is widely used in advanced photonics such as lasers﹐ receivers﹐ transceivers﹐ lighting﹐ and sensors﹐ etc.
• Carries key technological building blocks from our field-proven﹐ flexible and high-speed MRSI-HVM platform
• Heated head option designed for the higher density eutectic packaging
• “On-the-fly” auto tool changer has twelve vacuum tips/collets integrated on the bonding head for zero time tool change
MRSI-H-HPLD
• Specifically designed for bonding large high-power laser diodes in mass production
• Capable of die bonding single emitter﹐ bar laser in different packages﹐ like CoS﹐ C-mount﹐ Bar-on-Submount(BoS)﹐ etc. within one machine
• Customized design self-leveling tools for Co-planarity solution
MRSI-H-HPLD+
• Enhanced MRSI-H-HPLD with significantly higher speed.
MRSI-H-LDMOS
• Specifically designed for bonding GaAs﹐ Si﹐ GaN﹐ SiC dies for RF Power Amplifiers and Microwave Applications in mass production
• Programmable die scrubbing process for a void free bonding process
• Inline heaters﹐ conveyors and loader/unloader options for improve UPH
MRSI-H-TO
• Specifically designed for handling multi-dies and multi-processes for complex TO products without tool changeover. e.g. TO-based EMLs and WDM LDs for 5G
• TO handling module combined with pick and place head for dual parallel processing
• Capability of both epoxy and eutectic die bonding in one process flow
Value to our Customers
• Industry leading throughput﹐ superior flexibility﹐ and ultra-high-accuracy in high-volume﹐ high-mix manufacturing
• Easy to use icon-based interface running on a Windows™ platform for ease of programming﹐ and low-cost machine maintenance.
• Industry leading local technical support teams and application expertise
• 35+ years of experiences in the industry with reliable 24/7 field operation
MRSI-H系列的優勢
MRSI-H系列為真正的多晶片、多工藝、多產品大批量高混合生產提供了被驗證了的卓越的靈活性。這些高速產品提供業界領先的速度，而不犧牲靈活性，精度或可靠性。MRSI-H系列是應對5 g無線網路的推出和高增長的高功率半導體鐳射二極體(HPLD)市場帶來的製造業的挑戰。根據應用，MRSI將H系列重新分類。
MRSI-H-LD
• 該標準系統廣泛應用于先進的光子學領域，如雷射器、接收器、收發器、照明和感測器等。
• 攜帶有經過現場驗證證的靈活和高速MRSI-HVM平臺上的關鍵技術構建模組
• 加熱頭的選擇項是為高密度共晶封裝而設計的
• “運行中”自動更換工具模組可在貼片頭上集成十二個真空吸嘴或蘸頭，實現零時間工具切換
MRSI-H-HPLD
• 專為大批量生產的大型高功率鐳射二極體貼片而設計
• 能夠在一台機器內對不同封裝的單管器、Bar條雷射器進行貼片，如CoS、C-mount、bar條到基板 (BoS)等
• 定制設計的自平衡工具可有效解決共面性問題
MRSI-H-HPLD+
• 增強的MRSI-H-HPLD具有更高的速度。
MRSI-H-LDMOS
• 特別設計用於大規模生產射頻功率放大器和微波器件，可應用於GaAs﹐ Si﹐ GaN﹐ SiC貼片
• 可程式設計的摩擦貼片過程可實現無空洞的粘片
• 內聯加熱器，傳送帶和上/下料機的選項，可以提高設備的UPH
MRSI-H-TO
• 專為處理多晶片和多工藝複雜TO產品而設計，無需機器切換。例如:面向5G的EML和WDM的TO產品
• TO處理模組可結合取放頭進行並行處理
• 環氧樹脂和共晶貼片可在同一工藝流程中實現
對客戶的價值
• 行業領先的產出量，卓越的靈活性，和在大批量，高混合製造中超高的精度
• 易於使用在Windows™平臺上運行的基於圖示的介面，便於程式設計和低成本的機器維護。
• 行業領先的本地技術支援團隊和應用專家
• 35年以上行業經驗，可靠的全天候現場運行
The MRSI-H family provides proven superior flexibility for true multi-die﹐ multi-process﹐ multi-product high volume high mix production. These high-speed products deliver the industry-leading speed without sacrificing flexibility﹐ precision or reliability. The MRSI-H family targets the manufacturing challenges driven by 5G wireless network rollout and the high growth high-power semiconductor laser diode (HPLD) market. MRSI reclassified H series by application.
MRSI-H-LD
• This standard system is widely used in advanced photonics such as lasers﹐ receivers﹐ transceivers﹐ lighting﹐ and sensors﹐ etc.
• Carries key technological building blocks from our field-proven﹐ flexible and high-speed MRSI-HVM platform
• Heated head option designed for the higher density eutectic packaging
• “On-the-fly” auto tool changer has twelve vacuum tips/collets integrated on the bonding head for zero time tool change
MRSI-H-HPLD
• Specifically designed for bonding large high-power laser diodes in mass production
• Capable of die bonding single emitter﹐ bar laser in different packages﹐ like CoS﹐ C-mount﹐ Bar-on-Submount(BoS)﹐ etc. within one machine
• Customized design self-leveling tools for Co-planarity solution
MRSI-H-HPLD+
• Enhanced MRSI-H-HPLD with significantly higher speed.
MRSI-H-LDMOS
• Specifically designed for bonding GaAs﹐ Si﹐ GaN﹐ SiC dies for RF Power Amplifiers and Microwave Applications in mass production
• Programmable die scrubbing process for a void free bonding process
• Inline heaters﹐ conveyors and loader/unloader options for improve UPH
MRSI-H-TO
• Specifically designed for handling multi-dies and multi-processes for complex TO products without tool changeover. e.g. TO-based EMLs and WDM LDs for 5G
• TO handling module combined with pick and place head for dual parallel processing
• Capability of both epoxy and eutectic die bonding in one process flow
Value to our Customers
• Industry leading throughput﹐ superior flexibility﹐ and ultra-high-accuracy in high-volume﹐ high-mix manufacturing
• Easy to use icon-based interface running on a Windows™ platform for ease of programming﹐ and low-cost machine maintenance.
• Industry leading local technical support teams and application expertise
• 35+ years of experiences in the industry with reliable 24/7 field operation
MRSI-H系列的優勢
MRSI-H系列為真正的多晶片、多工藝、多產品大批量高混合生產提供了被驗證了的卓越的靈活性。這些高速產品提供業界領先的速度，而不犧牲靈活性，精度或可靠性。MRSI-H系列是應對5 g無線網路的推出和高增長的高功率半導體鐳射二極體(HPLD)市場帶來的製造業的挑戰。根據應用，MRSI將H系列重新分類。
MRSI-H-LD
• 該標準系統廣泛應用于先進的光子學領域，如雷射器、接收器、收發器、照明和感測器等。
• 攜帶有經過現場驗證證的靈活和高速MRSI-HVM平臺上的關鍵技術構建模組
• 加熱頭的選擇項是為高密度共晶封裝而設計的
• “運行中”自動更換工具模組可在貼片頭上集成十二個真空吸嘴或蘸頭，實現零時間工具切換
MRSI-H-HPLD
• 專為大批量生產的大型高功率鐳射二極體貼片而設計
• 能夠在一台機器內對不同封裝的單管器、Bar條雷射器進行貼片，如CoS、C-mount、bar條到基板 (BoS)等
• 定制設計的自平衡工具可有效解決共面性問題
MRSI-H-HPLD+
• 增強的MRSI-H-HPLD具有更高的速度。
MRSI-H-LDMOS
• 特別設計用於大規模生產射頻功率放大器和微波器件，可應用於GaAs﹐ Si﹐ GaN﹐ SiC貼片
• 可程式設計的摩擦貼片過程可實現無空洞的粘片
• 內聯加熱器，傳送帶和上/下料機的選項，可以提高設備的UPH
MRSI-H-TO
• 專為處理多晶片和多工藝複雜TO產品而設計，無需機器切換。例如:面向5G的EML和WDM的TO產品
• TO處理模組可結合取放頭進行並行處理
• 環氧樹脂和共晶貼片可在同一工藝流程中實現
對客戶的價值
• 行業領先的產出量，卓越的靈活性，和在大批量，高混合製造中超高的精度
• 易於使用在Windows™平臺上運行的基於圖示的介面，便於程式設計和低成本的機器維護。
• 行業領先的本地技術支援團隊和應用專家
• 35年以上行業經驗，可靠的全天候現場運行
