High-Accuracy Dispenser Quspa MsL 超高精度點膠機

The Quspa-MsL Dispensing System is primarily intended for the flip chip mounting of advanced semiconductor devices﹐ such as System-in-Package
(SiP)﹐ Multi-Chip Module (MCM) and Micro Processing Unit (MPU)﹐ as well as the underfilling of Chip Size Package (CSP) on surface-mounted PC boards.

Ultra-High Precision dispenser for Underfill
•Auger Screw Pump﹐ Jet Pump
•Linear Servo Drive Gantry System(±5µm)
•Vision System&Height Sensor
•Calibration Systems to the certain Parts of Quspa
Ex:Needle calibration﹐ camera calibration etc.

Application:
Flip-chip Underfill﹐ Wafer Level Package Dispensing﹐ AdvancedTechnology application etc.