SEMICONDUCTOR
3D CT X-Ray measurement 0.4-5um
Micron Flip-Chip DIE BONDERS
- MRSI-S-HVM 0.5-MICRON FLIP-CHIP DIE BONDERS - 0.5微米的覆晶黏晶機
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MRSI-HVM1 ULTRA PRECISION 1 MICRON FLIP-CHIP DIE BONDER-
高速,靈活的1微米 覆晶黏晶機,適應大批量生產
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MRSI-H1 FAMILY ULTRA PRECISION 1-MICRON FLIP-CHIP DIE BONDER
MRSI-H1系列: 高速,靈活的1微米覆晶黏晶機,適應大批量生產
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MRSI-HVM FAMILY 1.5-MICRON DIE BONDERS -
MRSI-HVM系列: 高速、靈活的1.5微米黏晶機,適應大批量生產
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MRSI-H FAMILY 1.5-MICRON FLIP-CHIP DIE BONDERS -
MRSI-H系列: 高速,靈活的1.5微米覆晶黏晶機,適應大批量生產
- MRSI-M3 3-MICRON FLIP-CHIP DIE BONDER - 3微米覆晶黏晶機
- MRSI-705 5-MICRON FLIP-CHIP DIE BONDER - 5微米覆晶黏晶機
Entrope®︎ Noise Probe
Nanoimprint
Vision Systems
- Microscope Scanner
- Bare Wafer Inspection
- Epitaxial and Patterned Wafer Inspection
- Diced Wafer Inspection
- Applications in Semiconductor
- Photoluminescence Scanner
Positioning Systems
Wafer Handling Systems
LASER Debonding and Cleaning Equipment
LASER Debonding Equipment
Macro Inspection Equipment
X-ray Bump / Void Inspection Equipment
Reliable 3D and 2D Measurements for Multi-process
- Wafer Inspection Systems
- Measuring System WAFERinspect
- Automated Optical MEMS Inspection
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Application in Semiconductor:
Roughness Measurement & Defect Inspection
Special Customized Machines Made in Germany
- Precision Tester PMA 2610 / 2630 / 2650
- Inspection Machine IPA 2014
- Laser Marker PLM 1600
- Tape and Reel PTA 3100
X-Ray Diffractometers
TSV RDL Copper Pillar Plating
Hybrid Microscope
3D IC TSV Back Grinding Process Inspection
Wafer Bump Inspection and Measurement System
Flip Chip Bonder
High Accuracy Die Mounter
High Accuracy Dispenser
3D CT X-RAY Inspection (Offline)
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Offline 3D CT SMX-6000
3D 電腦斷層X-Ray檢查機 -
Offline 3D CT SMX-225CT Plus
3D 電腦斷層X-Ray檢查機 -
Offline 3D CT SMX-100CT Plus
3D 電腦斷層X-Ray檢查機
X-Ray Inspection (Offline)
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Microfocus X-Ray TV System
SMX-2000 Plus 微焦X-Ray透視檢查裝置 (offline) -
Microfocus X-Ray TV System
SMX-1000 Plus 微焦X-Ray透視檢查裝置 (offline)
Wafer Vacuum Printer
Dispenser
Chemical Control Valve